The Department of Commerce ranked top 5 in the 2023 Best Places to Work in the Federal Government among large agencies for the 12th year in a row! The ranking showcases the Department's continued commitment to increasing employee engagement, employee satisfaction, and positive perceptions towards diversity, equity, accessibility, and inclusion. This notice is issued under direct-hire authority to recruit new talent to occupations for which NIST has a severe shortage of candidates.

Duties

Develop experiments to investigate wafer direct bonding bond strength Prepare chips and wafers for experimental investigation of chip-to-chip and chip-to-wafer direct bonding, including dicing, cleaning, patterning, etching, and surface activation Perform X-ray photoelectron spectroscopy measurements on plasma-activated water surfaces and analyze the resulting data. Develop recipes for an automated flip-chip bonder tool in the CNST Nanofab

Requirements

• U.S. citizenship
• Males born after 12-31-59 must be registered for Selective Service
• Suitable for Federal employment
• Bargaining Unit Position: No

Qualifications

BASIC REQUIREMENTS: Degree: Physical Sciences, Life Sciences, or Engineering that included 30 semester hours in chemistry, supplemented by course work in mathematics through differential and integral calculus, and at least 6 semester hours of physics. OR Combination of education and experience -- course work equivalent to a major as shown in A above, including at least 30 semester hours in chemistry, supplemented by mathematics through differential and integral calculus, and at least 6 semester hours of physics, plus appropriate experience or additional education. IN ADDITION TO THE BASIC REQUIREMENTS, APPLICANTS MUST POSSESS: One year of specialized experience equivalent to at least the GS-9 (ZP-II at NIST) level. Specialized experience is defined as: Performing microfabrication of electronic or photonic devices. Executing lithography mask design for microfabrication processes Applying microfabrication techniques including photolithography, plasma-enhanced chemical vapor deposition, physical vapor deposition, reactive ion etching, and focused ion beam milling Utilizing packaging techniques including wafer bonding, wafer dicing, and wire bonding Performing thin film and surface characterization using X-ray photoelectron spectroscopy, scanning electron microscopy, profilometry, ellipsometry, and infrared spectroscopy. OR Master's or equivalent graduate degree in chemistry or a field directly related to the duties of this position OR An equivalent combination of directly related graduate education and specialized experience Experience refers to paid and unpaid experience, including volunteer work done through National Service programs (e.g., Peace Corps, AmeriCorps) and other organizations (e.g., professional; philanthropic; religious; spiritual; community, student, social). Volunteer work helps build critical competencies, knowledge, and skills and can provide valuable training and experience that translates directly to paid employment. You will receive credit for all qualifying experience, including volunteer experience. The qualification requirements in this vacancy announcement are based on the U.S. Office of Personnel Management (OPM) Qualification Standards Handbook. Applicant Reconsideration

Education

This position has an education requirement. Transcripts must be submitted to validate that the education requirement has been met. Unofficial transcripts will be accepted in the application package. However, an official copy will be required before a final offer of employment.

Use of foreign education for qualifications. An accredited organization must evaluate education completed outside of the U.S. to ensure that it is comparable to education received in accredited institutions in the U.S. Click here to view a listing of accredited organizations from the Department of Education's website. A copy of the foreign education evaluation (containing the results with course-by-course listing) is required with your application.

Contacts

• Address Microsystems and Nanotechnology Division 100 Bureau Drive Gaithersburg, MD 20899 US
• Name: Tailor Thompson
• Email: [email protected]